Condensed Matter Physics

Robust TaNx Diffusion Barrier for Cu Interconnect Technology with Sub-Nanometer Thickness by Metal Organic Plasma-Enhanced Atomic Layer Deposition

H. Kim, C. Detavenier, O. van der Straten, S.M. Rossnagel, A.J. Kellock, and D.-G. Park

The Structure of Ba@C₇₄

A. Reich, M. Panthöfer, H. Modrow, U. Wedig, and M. Jansen

The Electron-Boson Spectral Function ²F() of High-T_c Superconductors

S.V. Dordevic, C.C. Homes, J.J. Tu, T. Valla, M. Strongin, P.D. Johnson, G.D. Gu, and D.N. Basov

Microscopic Origin of Polarity in Quasi-Amorphous BaTiO₃

A.I. Frenkel, Y. Feldman, V. Lyahovitskaya, E. Wachtel, and I. Lubomirsky

High Pressure Study of Structural Phase Transitions and Superconductivity in La_1.48Nd_0.4Sr_0.12CuO₄

M.K. Crawford, R.L. Harlow, S. Deemyad, V. Tissen, J.S. Schilling, E.M. McCarron, S.W. Tozer, D.E. Cox, N. Ichikawa, S. Uchida, and Q. Huang